发明名称 Conductive paste
摘要 A conductive paste having excellent printing properties, which can be used for manufacturing heat-resistant conductors and resistive elements, is described. Such a conductive paste can be obtained by preparing as a binder a polyimide precursor whose weight average degree of polymerization (n) ranges from 5 to 20, and mixing it with a solvent and a conductive powder. The polyimide precursor preferably is included in the range from 50 to 80 weight parts to 100 weight parts of the solvent. A polar solvent, or a mixed solvent including a polar solvent and a nonpolar solvent can be used. A preferable mixed solvent is a mixture of N-methyl-2-pyrrolidone and diethylene glycol dimethyl ether, in which the mixing volume ratio is preferably ranging from 2:8 to 9:1, more preferably, 2:8 to 3:7.
申请公布号 US6083426(A) 申请公布日期 2000.07.04
申请号 US19990327833 申请日期 1999.06.08
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 SHIMASAKI, YUKIHIRO;OZAKI, YUSUKE;HASEGAWA, MASANARU;KITAGAWA, TOSHIYUKI
分类号 H01B1/22;H01B1/24;H01C17/065;H05K1/09;(IPC1-7):H01B1/00;H01C7/10 主分类号 H01B1/22
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