| 摘要 |
PROBLEM TO BE SOLVED: To prevent environment contamination and to improve productivity by forming an antenna coil on an IC card by a plating method. SOLUTION: At the time of forming an antenna coil 3, a coil pattern whose form is almost the same as that of the antenna coil 3 and which is formed of conductive paste is made on a base material 1. The coil pattern formed of conductive paste is conducted. Thus, a copper film is formed on the coil pattern with prescribed film thickness. Then, the antenna coil 3 is formed in a corresponding area from an end part 3a on the outer peripheral side of the antenna coil 3 to a bending point 5 on the inner peripheral side of the antenna coil 3. The antenna coil 3 formed in an area between the bending point 5 of the inner peripheral side and the other terminal 2b of an electronic circuit part is coated by an insulating film 6. The bending point 5 of the antenna coil 3 is electrically connected with the other terminal 2b of the electronic circuit part. |
