发明名称 CONVEYING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a conveying apparatus which is improved in wafer conveying capability by decreasing the frequency of a track car travel over the whole conveyance path. SOLUTION: This conveying apparatus has an annular conveyance path 10, laid between semiconductor manufacturing apparatuses and a mechanism mounted with storage containers 21 and 22, capable of containing members used for the semiconductor manufacturing apparatuses and is equipped with track cars 11 and 12, which travel along the conveyance path as a track and a controller which controls setting and collecting operation for the storage containers 21 and 22 to and from the semiconductor manufacturing apparatuses as conveyance destinations. Also the track cars 11 and 12 are provided with coupling mechanisms 13 which couple the track cars for constituting a connected track car, which plural track cars made connectable by the coupling mechanism 13, and the controller uses a specific track car of the connected track car to collect the storage containers 21 and 22, and the rest track car is controlled for the setting of the storage containers 21 and 22.
申请公布号 JP2000188319(A) 申请公布日期 2000.07.04
申请号 JP19980365126 申请日期 1998.12.22
申请人 TOSHIBA CORP 发明人 KODAMA SHOICHI;YAJIMA HIROMI
分类号 H01L21/677;B65G49/07;H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/677
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