| 摘要 |
PROBLEM TO BE SOLVED: To miniaturize and lighten a unit by sticking an upper dielectric substrate and a lower dielectric substrate by adhesion, making a multilayer substrate, installing a space in a part of the lower dielectric substrate, incorporating SAW filters, installing a solder application part for loading lumped circuit elements on the upper face of the upper dielectric substrate and installing a land with solder on the lower face of the substrate. SOLUTION: An upper dielectric substrate 11 and a lower dielectric substrate 12 are stuck by adhesive 15 and a dielectric multilayer substrate is formed. Lumped circuit elements 13 constituting phase shift circuits and matching circuits are loaded on the upper face (uppermost face of dielectric mutilayer substrate) of the upper dielectric substrate 11, a space is installed in a part of the lower dielectric substrate 12 and SAW filters 16 are incorporated. Solder application parts 55 for loading the lumped circuit elements 13 are installed on the upper face of the upper dielectric substrate 11 and a land with solder, which loads the SAW filters 16, is installed on the lower face. Signal terminal or ground terminal patterns 18 are installed on the lower face of the lower dielectric substrate 12.
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