| 摘要 |
PROBLEM TO BE SOLVED: To fully control temperature and to promote the cooling effect of a work by providing, in two layers, a main heating part in a reflow oven for soldering a printed-wiring board and electronic parts and providing a cooling device away at a location that is further than a work inlet. SOLUTION: A work inlet 3 is provided at one side part of a reflow oven 1 for composing the main part of a reflow soldering device A, and a work outlet 6 is provided at the other side part. A conveyor 7 for carrying a work from the work inlet 3 to the outlet 6 is provided in the reflow oven 1, and a preliminary heating part 8, a main heating part 2, and a cooling part 5 are provided in this order. The preliminary heating parts 2 and 8 are divided into a plurality of layers of preliminary heating parts 2a, 2b, 8a, 8b, and 8c by a partition part 10 from the work inlet 3 to the side of the outlet 6. Also, the preliminary heating parts 8a-8c and the main heating parts 2a and 2b are provided with an infrared heater 11. Also, a fan 12 is provided at the upper portion of the preliminary heating parts 8a-8c, the main heating parts 2a and 2b, and the cooling part 5, and a cooling device 4 is provided at the main heating part 2a that is further than the inlet 3. |
