发明名称 Method for fabricating local interconnect
摘要 A method for fabricating a local interconnect. A gate having a gate oxide layer, a gate polysilicon layer and a cap layer is formed on a provided substrate. A spacer is formed on the sidewall of the gate, and a source/drain region is formed in the substrate. A planarized dielectric layer is formed over the substrate to expose the cap layer. A portion of the dielectric layer and the spacer on one side of the gate is removed to form an opening, so that the source/drain region is exposed. The opening is transformed into a local-interconnect opening by removing the cap layer. A local interconnect is formed by forming a conductive layer in the local-interconnect opening.
申请公布号 US6083827(A) 申请公布日期 2000.07.04
申请号 US19980212084 申请日期 1998.12.15
申请人 UNITED MICROELECTRONICS CORP. 发明人 LIN, TONY;CHEN, COMING;YEH, WEN-KUAN
分类号 H01L21/321;H01L21/336;H01L21/768;(IPC1-7):H01L21/476 主分类号 H01L21/321
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