发明名称 |
Manufacturing method of printed circuit board |
摘要 |
<p>In a manufacturing method of a printed circuit board comprising a process of coating insulative resin on a surface of a printed circuit board having a blind hole and a process of filling up the insulative resin in the blind hole, the printed circuit board coated with the insulative resin is kept in a low pressure atmosphere of 1.3 to 666 hPa, and then the insulative resin is hardened, so that the insulative resin is filled up in the blind hole appropriately. <IMAGE> <IMAGE> <IMAGE> <IMAGE> <IMAGE> <IMAGE> <IMAGE></p> |
申请公布号 |
EP1014769(A2) |
申请公布日期 |
2000.06.28 |
申请号 |
EP19990310466 |
申请日期 |
1999.12.23 |
申请人 |
VICTOR COMPANY OF JAPAN, LTD. |
发明人 |
SEKI, YASUAKI;SHIRATORI, SHIGENORI;SUZUKI, KENJI |
分类号 |
H05K3/40;H05K3/46;(IPC1-7):H05K3/46 |
主分类号 |
H05K3/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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