| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating method by which a printed wiring board, for example, is plated in uniform thickness at a high speed. SOLUTION: An anode plate is provided in a plating tank, and a material 6 to be treated is hung on a feeder hanger 8, continuously transported in the transporting direction in the plating tank and plated. In this method, an injector 9 for jetting a plating soln. orthogonally to the traveling material is furnished, flat guide plates 12 with the longitudinal direction parallel to the transporting direction and the lateral direction inclined so that the upper edge is closer to the material side are interposed between the injector 9 and the material 6, the direction of the plating soln. jetted from the injector 9 is regulated by the guide plates 12 and the resultant solution jets hit the material 6 which is to be plated.
|
