Electronic component manufacturing method

摘要

A manufacturing method of an electronic component comprises the steps of: mounting components on a sheet substrate having a plurality of component-mounting substrates and a plurality of through holes on which shield case-mounting electrodes are respectively formed; establishing a state in which a plurality of shield case pawls are inserted into the plurality of through holes to cover the components with shield cases, and solder is buried in the plurality of through holes; thereafter securing the plurality of shield cases to the sheet substrate to cover the components by melting the solder to secure the shield case pawls to the shield case-mounting electrodes of the through holes by the solder; and thereafter dividing the sheet substrate into the plurality of component-mounting substrates by cutting the sheet substrate, thereby producing a plurality of the electronic components each including the component-mounting substrate, the component mounted on the component-mounting substrate and the shield case secured to the component-mounting substrate for covering the component.