发明名称 HOT-MELT ADHESIVE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a hot-melt adhesive composition which combinedly has antinomic properties, namely fluidity at high temperatures and excellent heat- resistant flowability, is low in the surface tack at room temperature, and capable of repeatedly reproducing adhesion curing and fluidity to easily enable recycle utilization of adherends. SOLUTION: This hot-melt adhesive composition comprises 20-90 wt.% polymer having a reactive site capable of forming a hydrogen bond and a compound having two or more reactive sites capable of forming a hydrogen bond with the reactive site of the polymer with an equivalent ratio of the donor of -OH and/or -NHR (wherein, R is hydrogen, an alkyl group, an aryl group or an acyl group) to the acceptor of a tertiary amino group and/or a carbonyl group of >=0.1 as the combination of the reactive sites.
申请公布号 JP2000178528(A) 申请公布日期 2000.06.27
申请号 JP19980355964 申请日期 1998.12.15
申请人 YOKOHAMA RUBBER CO LTD:THE 发明人 IGAWA KATSUHIRO;CHINO KEISUKE
分类号 C09J123/26;C09J157/02;C09J201/00;(IPC1-7):C09J201/00 主分类号 C09J123/26
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