| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin sealing device which is capable of stabilizing a degating position, even when an insert block on which an object to be molded is mounted, is deviated at gate side end part position of a release film. SOLUTION: This resin sealing device is equipped with a mold 8 which clamps an object to be molded 1 whose region corresponding to the gate position of a circuit substrate 6 is gold-plated 7 and seals the object 1 with resin, a release film 3 which covers a parting face including a resin path 13 for sending a sealing resin 13 under pressure past the surface of the circuit substrate 6, of the object 1 stored in the mold 8 and a pot 11 into which the sealing resin 13 is supplied and a suction/retaining means for causing the release film 3 to suck to and to be retained by the parting face of the mold 8. On the surface of the mold 8, a bottom force insert block 15 on which the object 1 is mounted is always urged toward the parting face in a floating support fashion. In addition, the gate side end part position A of the bottom force-side release film 3 which covers the circuit substrate 6, of the object 1 mounted on the bottom force insert block 15, is tensely arranged so that the position A intersects with at least an area which is gold-plated 7. |
