CAVITY TYPE CHIP MODULE AND METHOD FOR FORMING CHIP CARRIER

摘要

PURPOSE: A cavity type chip module and a method for forming a chip carrier are provided to maintain a cavity without photoimageable material, and to prevent the photoimageable material from an edge into the cavity. CONSTITUTION: A cavity type chip module and a method for forming a chip carrier include a circuit accumulation layer, an implementation region(25), a metal stiffener(31), a binding layer(37), and a chip. The circuit accumulation layer includes a plane surface(29) and an opening(35). The opening is extended between the plane surface and defined by an inner edge in the accumulation. The metal stiffener(31) includes the implementation region(25) covering the opening. The binding layer(37) is bound between the stiffener(31) and the accumulation layer. The stiffener(31) is implemented on one of the plane surface of the accumulation layer and defines mating surfaces facing each other.