发明名称 CIRCUIT HAVING TEST AND REPAIR LOGICS OF SEMICONDUCTOR DEVICE
摘要 PURPOSE: A circuit is provided to enable a chip of a semiconductor device to be repaired after testing the chip at different temperatures. CONSTITUTION: A semiconductor chip comprises a semiconductor chip(2), a temperature sensor (3), and a self test and repair logic(4). The temperature sensor(3) is disposed adjacent to the semiconductor chip(2), and measures the temperature of the semiconductor chip(2) to transfer the measured result to the self test and repair logic(4) through an arrow(5). The self test and repair logic(4) commences a test mode through an arrow(6) when the temperature of the semiconductor chip(1) exists in a test temperature range. The self test and repair logic(4) makes the temperature of the chip(2) be increased or decreased when the temperature of the semiconductor chip(1) does not exist in a test temperature range.
申请公布号 KR20000035292(A) 申请公布日期 2000.06.26
申请号 KR19990049159 申请日期 1999.11.08
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 MACKONEL LODRIC;LIHITER DETREF
分类号 G01R31/28;G01R31/30;G11C29/04;G11C29/12;H01L21/66;(IPC1-7):H01L21/66 主分类号 G01R31/28
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