| 摘要 |
PURPOSE: A package method of semiconductor devices is provided to reduce package areas and costs by using improved outward electrode patterns without using a molding. CONSTITUTION: A common substrate(21) having a plurality of mounting parts(20) is prepared. An island portion(25) and a lead portion(32a,32) are formed on the front-side of the mounting parts(20), and a plurality of outward electrodes(31a-31d) are formed on the back-side of the mounting parts(20) via a through hole(30). The patterns of the outward electrodes(31a-31d) are backspaced from the end portion to the inner portion. On each mounting part(20), a semiconductor chip(33) is die-bonded and wire-bonded, and an epoxy layer(35) is coated on the entire surface of the resultant structure. By dividing the epoxy layer(35) and the common substrate(21) according to a dicing line(24), an individual semiconductor device is achieved. |
