发明名称 HEAT-TREATING DEVICE
摘要 PROBLEM TO BE SOLVED: To improve the treatment efficiency of a material to be treated without requiring a large installation space. SOLUTION: A heat-treating device is provided with a furnace body 2 with a gateway 15 that is opened in a crosswise direction, a drive device for turning a support member 4 around an axis in upper and lower directions so that a material 3 to be treated being supported by the support member 4 can be orbited around the axis in the upper and lower directions, and the heat-treating device of the material 3 to be treated. The position of the support member 4 for the furnace body 2 is determined so that the material 3 to be treated can enter or exit the furnace body 2 through the gateway 15 due to the orbiting. The material 3 to be treated can be supported or released by the support member 4 outside the furnace body 2.
申请公布号 JP2000171163(A) 申请公布日期 2000.06.23
申请号 JP19980344445 申请日期 1998.12.03
申请人 KOYO THERMO SYSTEM KK 发明人 FUJITA OUDO
分类号 C21D1/74;C21D1/767;F27B9/16;F27D3/12;(IPC1-7):F27B9/16 主分类号 C21D1/74
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