发明名称 METHOD AND DEVICE FOR CUTTING LEAD, AND RECORDING MEDIUM WHERE ITS CONTROL PROGRAM IS RECORDED
摘要 PROBLEM TO BE SOLVED: To provide a lead cutting device which accurately cuts a lead without being affected by dispersion in a product size while easily coping with change in product size and appearance. SOLUTION: A load calculation part 2 calculates a load when each of dies 11-14 contacts a product based on the measurement value of load cells 11a-14a in the dies 11-14. A die drive mechanism 3 moves the dies 11-14 in vertical and horizontal directions according to the control of a lead molding control part 1. A punch drive part 4 drives a punch to cut product's lead according to the control of the lead molding control part 1 when positioning of the dies 11-14 and pads 21-24 complete. A load calculation part 5 calculates a load when each of the pads 21-24 contacts a product based on the measurement value of load cells 21a-24a in the pads 21-24. A pad drive mechanism 6 moves each of the pads 21-24 in vertical and horizontal directions according to the control of the lead molding control part 1.
申请公布号 JP2000174190(A) 申请公布日期 2000.06.23
申请号 JP19980342266 申请日期 1998.12.02
申请人 NEC CORP 发明人 ISE HIROSHI
分类号 H01L23/50;(IPC1-7):H01L23/50 主分类号 H01L23/50
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