发明名称 |
METHOD AND DEVICE FOR CUTTING LEAD, AND RECORDING MEDIUM WHERE ITS CONTROL PROGRAM IS RECORDED |
摘要 |
PROBLEM TO BE SOLVED: To provide a lead cutting device which accurately cuts a lead without being affected by dispersion in a product size while easily coping with change in product size and appearance. SOLUTION: A load calculation part 2 calculates a load when each of dies 11-14 contacts a product based on the measurement value of load cells 11a-14a in the dies 11-14. A die drive mechanism 3 moves the dies 11-14 in vertical and horizontal directions according to the control of a lead molding control part 1. A punch drive part 4 drives a punch to cut product's lead according to the control of the lead molding control part 1 when positioning of the dies 11-14 and pads 21-24 complete. A load calculation part 5 calculates a load when each of the pads 21-24 contacts a product based on the measurement value of load cells 21a-24a in the pads 21-24. A pad drive mechanism 6 moves each of the pads 21-24 in vertical and horizontal directions according to the control of the lead molding control part 1.
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申请公布号 |
JP2000174190(A) |
申请公布日期 |
2000.06.23 |
申请号 |
JP19980342266 |
申请日期 |
1998.12.02 |
申请人 |
NEC CORP |
发明人 |
ISE HIROSHI |
分类号 |
H01L23/50;(IPC1-7):H01L23/50 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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