发明名称 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT USING IT, AND MANUFACTURES OF RESIST PATTERN AND PRINTED CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a photosensitive resin composition superior in photosensitivity, resolution, resistance to chemicals, adhesiveness, mechanical strength, and flexibility. SOLUTION: The photosensitive resin composition contains a binder polymer having carboxyl groups, a photopolymerizable unsaturated compound having at least one ethylenically unsaturated bond and a photopolymerization initiator and as the essential components, compounds represented by formulae I and II in which each of R4 and R5 is an H atom or a methyl group; each of X and Y is a 2-6C alkylene group; and each of Z1 and Z2 is a halogen or H atom or a 1-20C alkyl or 3-10C cycloalkyl, amino, aryl optionally substituted by 1-20C alkyl group, 1-20C alkoxy group, or a group having a hetero ring.
申请公布号 JP2000171971(A) 申请公布日期 2000.06.23
申请号 JP19980345349 申请日期 1998.12.04
申请人 HITACHI CHEM CO LTD 发明人 ICHIKAWA TATSUYA;OHASHI TAKESHI
分类号 H05K3/06;C08F2/50;C08F299/02;G03F7/027 主分类号 H05K3/06
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