发明名称 SOLDERING EQUIPMENT AND METHOD OF USING IT
摘要 PROBLEM TO BE SOLVED: To prevent the detrioration of a soldering quality by providing a jetting nozzle with a plurality of nozzle plates, each having blowout ports for molten solder, and changing a shape and an opening area of the blowout ports by overlapping the nozzle plates with the blowout ports being shifted from each other. SOLUTION: On the main body 14a of a nozzle, two nozzle plates 14e are fixed. Each of the nozzle plates 14c is formed with a plurality of circular nozzle holes 14d (blowout ports). A shape and an opening area of the blowout ports for blowing out molten solder can be changed by adjusting a quantity of shift between the nozzle holes 14d of the upper and the lower nozzle plate 14c. By changing the shape and the opening area of the blowout ports, a jet-out state of solder such as a shape, a quantity, and a height, etc., of jet-out solder can be adjusted.
申请公布号 JP2000174427(A) 申请公布日期 2000.06.23
申请号 JP19980346880 申请日期 1998.12.07
申请人 SONY CORP 发明人 FURUKAWA JUNICHI
分类号 H05K3/34;(IPC1-7):H05K3/34 主分类号 H05K3/34
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