| 摘要 |
<p>PROBLEM TO BE SOLVED: To make operation possible in a light room, and to enhance handleability, resolution, adhesiveness and storage stability and to make possible formation of a pattern high in density and precision and freedom by forming a photosensitive resin layer containing an infrared absorbing dye between a transparent organic support and an organic protective layer. SOLUTION: The photosensitive resin layer contains an alkali-soluble resin and a compound having an ethylenically unsaturated double bond and a polymerization initiator and the infrared absorbing dye and it is interposed between the transparent organic support and the organic protective layer, thus permitting a pattern high in density and precision and freedom to be formed by the direct depiction method using semiconductor laser beams, and the photosensitive resin layer to be stabilized by laminating it between the layers and good resolution and adhesiveness to be obtained contrary to the ultraviolet hardened type dry film.</p> |
