发明名称 BURN-IN TESTING METHOD OF SEMICONDUCTOR CHIP, BURN-IN TESTING DEVICE, AND SEMICONDUCTOR CHIP USED FOR BURN-IN TESTING METHOD
摘要 PROBLEM TO BE SOLVED: To give a current stress to all circuit nodes and efficiently perform burn-in by changing a power supply pulsingly. SOLUTION: A power supply Vcc is supplied to the internal circuit of a semiconductor chip pulsingly from 0 V to a burn-in voltage Vbi, thus giving a current stress to the entire internal circuit and hence performing a burn-in test efficiently. By changing the power supply Vcc pulsively from a voltage that is at least a threshold voltage Vth to the burn-in voltage Vbi, or the pulse waveform of the power supply Vcc is set so that a period TH of a high voltage becomes longer than a period TL of a low voltage, the burn-in test time can be further shortened.
申请公布号 JP2000174081(A) 申请公布日期 2000.06.23
申请号 JP19980346829 申请日期 1998.12.07
申请人 MITSUBISHI ELECTRIC CORP 发明人 YAMAMOTO SHIGEHISA
分类号 G01R31/26;G01R31/28;H01L21/66;(IPC1-7):H01L21/66 主分类号 G01R31/26
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