| 摘要 |
<p>A method for effectively preventing a forgery of paper or film-form medium, wherein, for one solution, a thin, antenna-equipped semiconductor chip up to 0.5 mm square is embedded in a medium with the side walls of the chip formed with oxide films and separated from the chip by etching. Limiting the size of the semiconductor chip to up to 0.5 mm can improve resistances against bending and concentrated over loading, etching separation can provide a crack-, breakage-free semiconductor chip, and oxide films on the side walls require a simple process in preventing short-circuiting at edges when bonded to an antenna.</p> |
