COMPOSITIONS AND METHODS FOR POLISHING SEMICONDUCTOR WAFERS

摘要

Stable dispersions of submicron abrasive particles are provided by using an amino alcohol as a stabilizing component. A composition is provided, suitable for polishing an insulating or barrier layer, comprising: water, an aqueous dispersion of submicron abrasive particles for which an amino alcohol is used as a stabilizing component, and a chemically interactive component which interacts with the surface being polished. Also provided is an additive for CMP polishing slurries which is an organic polymer having a degree of polymerization of at least five, the polymer having a plurality of moieties with affinity to surface groups on the surface being polished.