发明名称 |
SOUND INSULATION FLOOR PANEL AND SOUND INSULATION FLOOR PANEL MOUNTING STRUCTURE |
摘要 |
PROBLEM TO BE SOLVED: To provide a sound insulation floor panel and sound insulation floor panel mounting structure excellent in sound insulation efficiency capable of easily executing site work in accordance with specifications for a house at a low cost even when it is a wooden or steel framed house. SOLUTION: This sound insulation floor panel mounting structure is so constituted that a sound insulation floor panel sticking a cement based plate-like body 3 having flexural rigidity over 300×104 kg.cm2 and mass per unit area over 30 kg/m2 on the upper surface of a frame body formed by assembling rectangular lumber 21 having geometrical moment of inertia over 60 cm4 with an adhesive 4 and nails 5 and the floor panel are built on a beam and/or a horizontal member and that thet are directly fixed.
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申请公布号 |
JP2000170305(A) |
申请公布日期 |
2000.06.20 |
申请号 |
JP19980344026 |
申请日期 |
1998.12.03 |
申请人 |
OKURA IND CO LTD;NATIONAL HOUSE INDUSTRIAL CO LTD |
发明人 |
OKADA TAKESHI;SASAKI SHINJI;MURAKAMI MANABU;YOSHIDA SHIGEO;KITAGAWA SATOSHI;SATO HIROSHI |
分类号 |
G10K11/16;E04B1/82;E04B1/86;E04B5/02;E04B5/43;E04C2/38;(IPC1-7):E04B5/43 |
主分类号 |
G10K11/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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