发明名称 ADHESIVE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain an adhesive composition low in changing of stable material physical properties such as the maximum tensile strength and the maximum elongation under heated and alkaline environments by adding a specific filler to a modified silicone resin and an epoxy resin as main components. SOLUTION: This adhesive composition comprises (A) 100 pts.wt. of a modified silicone resin, (B) 0.1-20 pts.wt. of a catalyst for the component A (for example, a carboxylic acid metal salt such as octylic acid tin salt), and (C) 0.1-200 pts.wt. of a filler (preferably an organic polymer foam such as an ethylene-vinyl acetate copolymer resin or an acrylic resin) having a bulk density of <=0.5 and comprising a foam on whose surface an inorganic agent is coated. The composition may comprise the components A and B, 10-500 pts.wt. of (D) silica in stead of the component C as a filler, further preferably an epoxy resin in an amount of 0.5-300 pts.wt. per 100 pts.wt. of the component A, and an epoxy resin-curing agent in an amount of 0.1-200 pts.wt. per 100 pts.wt. of the component A.
申请公布号 JP2000169822(A) 申请公布日期 2000.06.20
申请号 JP19980349641 申请日期 1998.12.09
申请人 YOKOHAMA RUBBER CO LTD:THE;SHIMIZU CORP 发明人 YAMAMOTO MASAKI;ONO TADASHI;NACHI HIROSHI
分类号 C09J163/00;C09J183/04;(IPC1-7):C09J183/04 主分类号 C09J163/00
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