| 摘要 |
PROBLEM TO BE SOLVED: To reduce positional displacements of inner and outer layer patterns, by correcting the amount of positional displacement of a circuit pattern using recognition marks as a reference, and forming via holes or the circuit pattern in an outer conductive layer. SOLUTION: A core substrate 5 is made of a circuit pattern and a plurality of recognition marks 4. The circuit pattern is formed by etching a metal foil of a metal-clad laminate prepared by laminating a plurality of inner insulating layers 11 and inner conducive layers 12. An outer insulating layer 13 and an outer conductive layer 14 are laminated on the substrate 5, and the layer 14 is thereafter evenly thinned. Then, the marks 4 are read by a recognition device to thereby recognize the position of a pattern of the layer 11 and the amount of displacement of the laminated substrate from the positions of the marks 4 as reference positions for correction. The layers 14 and 13 are removed based on these reference positions for correction, and via holes are thereafter formed. The via holes are electrically connected, and the layer 14 is then etched by a subtractive method to thereby form the circuit pattern. |
