| 摘要 |
PROBLEM TO BE SOLVED: To prevent generation of stresses from resin sealing material in a package, which is formed in a state in which an element disliking stress and scattering of incident light is electrically connected with an ordinary semiconductor element. SOLUTION: On an island 16, an insulating substrate 10 is formed, on which a first semiconductor element 14 and a second semiconductor element 15 are fixed. A second resin sealing material 22 is spread on the second semiconductor element 15. In this state, the substrate is set in metallic molds K1, K2. A second resin sealing material is made to abut against the metal mold K1, and a first resin sealing material 23 is injected. As a result, two resin sealing parts are formed in the same plane.
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