| 摘要 |
PROBLEM TO BE SOLVED: To obtain an ashing device which prevents a reactive product from adhering and depositing on a sidewall face of an upper electrode or an upper face of a chamber and prevents the occurrence of dust due to the deposit. SOLUTION: In an ashing device in which an upper electrode 1 and lower electrode 2 are provided in a chamber 10, and a wafer 3 is mounted on the lower electrode 2, and plasma is produced between the upper electrode 1 and lower electrode 2 for removing resist on a surface of the wafer 3. In this case, a heating means 4 for heating the side face of the upper electrode 1 and an upper face of the chamber 10 is provided.
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