| 摘要 |
PROBLEM TO BE SOLVED: To provide an inexpensive multilayer wiring board in which the discontinuity and shorting of a wiring circuit do not occur, a warp does not occur, the thickness of the board is reduced, requested miniaturization, thinning and high precision are realized and whose number of manufacture processes is small. SOLUTION: A multilayer wiring layer B having insulating layers 1 containing thermosetting resin whose coefficient difference of thermal expansion with a core wiring board A is not more than 20 ppm/ deg.C, wiring circuit layers 2 where metal foil is buried on the surfaces of the insulating layers 1 and via hole conductors 3 is formed on one face of the core wiring board A. The thickness of the mulilayer wiring board B is set to be not more than 2/3. Thus, the inexpensive multilayer wiring board which is superior in the surface flatness on the surface of the wiring board, in which a warp does not occur in the board, the thickness of the board is thin, which is miniaturized, thinned and is made into high precision is provided. |
