发明名称 PACKAGING STRUCTURE OF PIEZOELECTRIC TRANSDUCER
摘要 PROBLEM TO BE SOLVED: To reduce the size in height and thereby reduce stature by forming, in a substrate, windows so as not to interfere with vibration, when a piezoelectric transducer is driven and forming piezoelectric transducer support sections between the windows, and then installing a piezoelectric transducer with an adhesive through the support sections. SOLUTION: A substrate P is provided with windows W1-W3 which pass through both sides of a substrate. Between the central window W2 and the window W1 on one side and the window W3 on the other side, piezoelectric transducer support sections A, B are formed. A piezoelectric transducer T is, so installed that a primary and a secondary node of the transducer T is positioned at the support sections A and B, respectively. In the installation, a node of a primary-side electrode 3 formed on the lower surface of the transducer T is fixed to the support section A with a conductive adhesive. Then, the node of a secondary-side part on the lower surface of the transducer T is fixed to the support section B with a vibration-proof elastic adhesive.
申请公布号 JP2000164948(A) 申请公布日期 2000.06.16
申请号 JP19980337319 申请日期 1998.11.27
申请人 TAMURA SEISAKUSHO CO LTD 发明人 MATSUO YASUHIDE;HASHIGUCHI YUSAKU;WADA TETSUYA
分类号 H01L41/107;(IPC1-7):H01L41/107 主分类号 H01L41/107
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