| 摘要 |
PROBLEM TO BE SOLVED: To dispense with expensive conductive paste by a method wherein a fitting part which is engaged with the tip of a bump is provided to a carrier or a foot print provided to a printed wiring board. SOLUTION: When a semiconductor chip 5 is connected to a carrier 3 or a printed wiring board 4 through a CSP(Chip Scale Package) method, a fitting part 2 engaged with the tip of a bump 6 is provided to the carrier 3 or a foot print 1 provided to the printed wiring board 4. The fitting part 2 is like a mortise joint, a mortise 7 is bored in the foot print 1, the tip of the bump 6 is formed like a tenon 8, and the tenon 8 is inserted into the mortise 7 to enhance the fitting part 2 in bonding strength. By this setup, the tip of the bump 6 of the semiconductor chip 5 is fitted in the fitting part 2, so that expensive conductive paste can be dispensed with.
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