| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device, wherein terminal pads for external connection are prevented from being covered with mold resin sneaking the lower surface of an insulating substrate, and the electrical connections between the terminal pads and wiring conductor of an external electric circuit can be made sure and rigid, in a resin molded semiconductor device. SOLUTION: A flange part 5, whose one end protrudes outside from the side surface is attached on the outer peripheral part of the lower surface of an insulating substrate 1 which has a mounting part 1a on which a semiconductor element 7, is mounted and electrode pads 2 to which electrodes of the semiconductor element 7 are connected on the upper surface and has terminal pads 3 electrically connected with the electrode pads 2 on the lower surface. A molding resin 7 is prevented from sneaking the lower surface of the insulating substrate 1, on which lower surface terminal pads 3 are formed.</p> |
