MANUFACTURE OF MULTILAYER PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a manufacture method of a multiyear printed wiring board where the thickness of a metal layer on the surface of an insulating layer is thinned and a conductor layer is formed of a fine circuit pattern, while the thickness of a metal layer in a via hole is secured and connection reliability between the conductor layers is secured. SOLUTION: A multilayer printed wiring board, where conductor layers 1 and insulating layers 2 are alternately installed and the conductor layers 1 are connected through via holes 3 installed in the insulating layers 2, is manufactured. Metal layers 4 are formed on the surface of the insulating layers 2 where the via holes 3 are installed and in the via holes 3. Work for thinning the thickness of the metal layers 4 on the surfaces of the insulating layers 1 while the thickness of the metal layers 4 in the via holes 3 are kept is executed. Then, a circuit is formed by the metal layers 4 on the surfaces of the insulating layers 2 and the conductor layers 1 are formed.