| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor element housing package, equipped with connection terminals of brazing material and its mounting structure, where shearing stress is restrained from occurring in the connection terminals of brazing material, so as to enhance the connection terminals in connectability to an outer circuit board, even if the housing package is repeatedly subjected to a heat cycle caused by an on/off turned semiconductor element. SOLUTION: A semiconductor element housing package A is equipped with a ceramic insulating board 1 mounted with a semiconductor element 2, solder connection terminals 5 provided to the base of the board 1, a metallized wiring layer 3 which electrically connects the semiconductor element 2 to the connection terminals 5, and a lid 6 which hermetically seals the semiconductor element 2 mounted on the surface of the insulating board 1, where a recess 8 is provided at a region underside the insulating board 1, corresponding to the semiconductor element mounting region of its upside, and shearing strain induced in the connection terminals 5 when the connection terminals 5 are mounted on a wiring conductor 7 located on the surface of an outer circuit board B can be reduced, so that the connection terminals 5 can be improved in resistance to thermal fatigue. |
