| 摘要 |
PROBLEM TO BE SOLVED: To enable a semiconductor device to be improved in mass productivity, lessened in cost, and enhanced in reliability. SOLUTION: Eight WPPs 5 which are each equipped with a semiconductor chip 1 as a memory chip and a bump electrode 1c electrically connected to the pad of the chip 1 are prepared, and a module board 3 provided with outer terminals and capable of supporting the eight WPPs 5 is prepared, the rears 5b of the WPPs 5 are bonded to a heat-dissipating plate 4, thereafter the bump electrodes 1c of the eight WPPs 5 mounted on the plate 4 are connected electrically to the module board 3, and the eight WPPs 5 with the heat-dissipating plate 4 are mounted on the module board 3 for assembling a memory module 10.
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