| 摘要 |
<p>PROBLEM TO BE SOLVED: To realize a semiconductor device which is capable of coping with a mounting manner such as wire bonding mounting, flip chip mounting or the like by a method wherein electrodes that are connected together are arranged on a semiconductor chip symmetrically to each other about a diagonal line. SOLUTION: A semiconductor device 1 is equipped with a Vcc pad 2, RST pads 3 and 13, CLK pads 4 and 14, GND pads 5 and 15, and an I/O pad 6 formed on a semiconductor chip 1a. The RST pads 3 and 13, the clock pads 4 and 14, and the GND pads 5 and 15 are each arranged symmetrical to each other about the diagonal lines of the semiconductor chip 1a. Furthermore, the RST pads 3 and 13 are connected together with a wiring, the CLK pads 4 and 14 are connected together with a wiring, an the GND pads 5 and 15 are connected together with a wiring. By this setup, the semiconductor device 1 is capable of coping with a mounting manner such as wire bonding mounting, flip chip bonding or the like.</p> |
