| 摘要 |
PROBLEM TO BE SOLVED: To prevent an insulating board from floating so as to restrain a semiconductor device from increasing in heat resistance, where an insulating board is mounted on a fin via grease in the semiconductor device. SOLUTION: A semiconductor device is composed of a thin-walled insulating board 21 equipped with a metal circuit 21a formed on its surface layer and mounted with a semiconductor chip 1 on the metal circuit 21a, a terminal block 7 provided with an outer connection terminal for connecting the metal circuit 21a to the outside, and an outer case 11 formed covering the periphery of the insulating board 21 and surrounding the terminal block 7, where the insulating board 21 is attached directly to a heat-radiating body to dissipate heat. The outer case 11 is equipped with a press member 20a, which presses down nearly the center of the insulating board 21. |
