| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device, capable of ensuring reliability of connection and electric conduction between bumps on a semiconductor element and a wiring pattern on a circuit board, when a circuit of the semiconductor device is made into a microstructure and the an output electrode pad is reduced in size, and a manufacturing method of the semiconductor device. SOLUTION: A first and a second metal bumps 2, 10 are formed as conducting members on an strip-shaped electrode pad 6 formed on a circuit board 4. A semiconductor element 1, in which the first and the second metal bumps 2, 10 are formed on the electrode pad 6, is mounted on a wiring pattern of a circuit board through facedown bonding. When it is mounted, a resin layer formed of photocuring resin or thermosetting resin is interposed between the semiconductor element 1 and the circuit board, and after bonding, subjected to photocuring or thermosetting while pressure is applied. |
