发明名称 MANUFACTURING WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To avoid electric-short circuiting or large reduction in insulation resistance between adjacent wiring conductor layers. SOLUTION: A ceramic green sheet 1 is made by adding and mixing a coloring agent of Mo oxide powder having an aspect ratio of 3 or less and mean grain size of 4μm or less, an org. solvent and a solvent to a ceramic powder and sheeting the mixture. The green sheet 1 is baked in a reducing atmosphere to form a black ceramic insulation board 1a, and a wiring conductor layer 2a is formed thereon, wherein exposing a thin and long metal Mo of several tens of microns long on the insulation board 1a surface can be avoided. Consequently electrical short-circuiting or large reduction in insulation resistance between adjacent wiring conductor layers 2a can be prevented.
申请公布号 JP2000164754(A) 申请公布日期 2000.06.16
申请号 JP19980334650 申请日期 1998.11.25
申请人 KYOCERA CORP 发明人 YOMO KUNIHIDE;ITO HIROSHIGE
分类号 H01L23/12;H01L23/15;(IPC1-7):H01L23/12 主分类号 H01L23/12
代理机构 代理人
主权项
地址