SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A semiconductor package and a method for manufacturing the same is provided to shunt an electrical short between a semiconductor chip and a lead(or ball land). CONSTITUTION: A semiconductor package includes a semiconductor chip mount(2), a conducting binding material(5), a ball land(3), a lead(4) and a dielectric material. The semiconductor chip mount(2) includes a semiconductor chip(1) applied under it. The ball land(3) and the lead(4) are located on under the semiconductor chip(1). The lead(4) or the ball land(3) under the semiconductor chip(1) are electrical shunt by way of the dielectric material. The dielectric material can be a dielectric tape(11) binding the ball land(3) or the lead(4) with the semiconductor chip(1) for electrical shunt.