UNDERFILL TOOL FOR SEMICONDUCTOR PACKAGE

摘要

PURPOSE: An under filter device for semiconductor package is provided to improve the reliability of a semiconductor device by preventing air bubble between a printed circuit board and a package when performing an under filter process. CONSTITUTION: An under filter device for semiconductor package comprises a wall body(10), a vacuum hole(11), and a vacuum supply pipe(13). The wall body(10) has a predetermined height and a predetermined thickness to cover a package. A molding solution inflow hole(10a) is formed to provide a molding solution between a printed circuit board and the package. The vacuum hole(11) is formed at an inner side of the wall body(10). The vacuum hole(11) is connected with a vacuum line(12). The vacuum supply pipe(13) is installed at one end portion of the vacuum line(12) in order to provide vacuum.