| 摘要 |
PROBLEM TO BE SOLVED: To improve the repairability of a low heat-resistant glass epoxy base after a semiconductor is mounted on the base. SOLUTION: After a thermosetting sealing resin 3a, to which an ultraviolet curing property is given, is supplied to a carrier base 4 and a bare IC 1 is placed on the base 4, the IC 1 is mounted on the base 4 by heating and pressurizing the IC 1. After mounting, the mounted substrate is inspected electrically, and when the substrate is non-defective, the bonding strength of the IC 1 is improved by having the IC 1 irradiated with ultraviolet rays. When the substrate is defective, repairing is performing by stripping the IC 1. At the repairing, the repairing can be made, even when the sealing resin 3a is heated to room temperature or to the glass-transition temperature of the base 4 or lower, because the bonding strength of the resin 3a when the IC 1 is heated and pressurized is not perfect due to an ultraviolet curing component added to the resin 3a.
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