| 摘要 |
PURPOSE: A hybrid integrated circuit and a method for manufacturing the hybrid integrated circuit are provided to make the hybrid integrated circuit more strong to endure great outer shock. CONSTITUTION: A hybrid integrated circuit and a method for manufacturing the hybrid integrated circuit include a substrate, a circuit pattern, components and elements(12,13,14) with small sensitivities to temperature, components and elements with big sensitivities to temperature, and a press pit lead frame. The substrate has a thickness over a predetermined value to endure a shock imposed during operation. The circuit pattern is designed in multi-layers. Signal lines with small sensitivities to a noise are arranged in the inner layer of the pattern. Components and elements(12,13,14) with small sensitivities to temperature are implemented in the forefront of the circuit pattern. Components and elements with big sensitivities to temperature are implemented in the back side of the circuit pattern. The press pit lead frame are pressed on the output pads on both sides of the substrate.
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