发明名称 |
APPARATUS FOR REMOVING PARTICLES ON CHUCK OF CVD EQUIPMENT |
摘要 |
PURPOSE: An apparatus for removing particles on a chuck of CVD equipment is provided to remove the particles formed on a top surface of a chuck to prevent the particles to be attached to a rear surface of a wafer, thereby excluding a process for purging the rear surface of the wafer. CONSTITUTION: An on/off port(10) is formed on one side of a chamber(1') of the CVD equipment. A particles absorbing plate(12) is driven by a driver such as a robot arm(11) to move to a chuck(2') within the chamber(1') through the on/off port(10), and is charged by DC voltage to be mounted in outside of the chamber(1') near the on/off port(10). A particles absorbing plate storage room(14) is formed to surround particles absorbing plate(12) to be opened to the chamber(1') through the on/off port(10), and is connected to a pump(5) via a pumping line(13). DC voltage can be applied to a top surface of the chuck(2') to charge the chuck(2').
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申请公布号 |
KR100258864(B1) |
申请公布日期 |
2000.06.15 |
申请号 |
KR19970066083 |
申请日期 |
1997.12.05 |
申请人 |
HYUNDAI MICRO ELECTRONICS CO., LTD. |
发明人 |
LEE, SANG-JUN |
分类号 |
H01L21/00;(IPC1-7):H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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