| 摘要 |
PURPOSE: A structure of a semiconductor L.O.C package is provided to enable the electrical connection between bonding pads and an under-layered chip to maximize the function of the chip in designing the chip, and exclude a wire bonding process to shorten fabricating period and minimize the thickness of the package as well as prevent the electrical resistance loss through wires. CONSTITUTION: A plurality of leads(16) having a bonding pad(15) on a bottom surface for promoting bonding with a chip(11) are molded with compound(17). The bonding pads(15) formed of an anisotropy conductive film are electrically connected to the chip(11) by a thermal compression process. A plurality of bumps(13) are integrally formed on the chip(11). It is preferable that the height of the bump(13) is 80% or below of the thickness of the bonding pad(15) so that the function of the bonding pad(15) can be maximized.
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