| 摘要 |
PROBLEM TO BE SOLVED: To prevent non-uniformity of polishing of a wafer by mounting a device (cylindrical body) including a plurality of abrasive pads to the outside of a hollow core in parallel with the hollow core, moving the abrasive pads (cylindrical) in the X-Y-Z direction, and rotating it. SOLUTION: For example, a device (cylindrical body) including four abrasive pads 58 is mounted to the outside of a hollow core 56 in parallel with the hollow core 56. A pad/core assembly 54 is rotated around its axial line 82 by a rotation actuator 64. The pad/core assembly 54 moves in the X-Y-Z direction as well as the rotation. A wafer carrier 53 mounted with a wafer 52 is also rotated around the axial line 82. In performing a polishing operation, an abrasive pad conditioner 60 is abutted to the abrasive pads 58. This abutting recovers and adjusts the abrasive pads 58. The rotation driving device 64 rotates the pad/core assembly 54 around the axial line 82. |
