发明名称 |
ELECTROLESS-PLATING OF MAGNESIUM ALLOY |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming a highly adhesive electroless plating film good for the environment. SOLUTION: An electroless-plating film is formed on a body to be plated consisting of magnesium or a magnesium alloy by this method. Concretely, the body is dipped in a soln. contg. a palladium catalyst to substitute palladium on the body surface in a catalyst imparting stage. The catalyst-imparted body is dipped in an electroless-plating bath, and the metal contained in the bath is deposited in an electroless plating stage.
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申请公布号 |
JP2000160347(A) |
申请公布日期 |
2000.06.13 |
申请号 |
JP19980341410 |
申请日期 |
1998.12.01 |
申请人 |
MELTEX INC |
发明人 |
KAWAMURA TAKAHARU;ISHIZUKA SHIGERU |
分类号 |
C23C18/18;C23C18/36;(IPC1-7):C23C18/18 |
主分类号 |
C23C18/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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