发明名称 DIE GAP ADJUSTING DEVICE OF PLATE THICKNESS PRESSURIZING PRESS DEVICE
摘要 PROBLEM TO BE SOLVED: To easily adjust plate thickness after high pressurization by using the same die. SOLUTION: This press device is equipped with a pair of dies opposed to each other at upper/lower parts in a manner to sandwich a slab, and an oscillating device for moving upper and lower dies upwards/downwards symmetrically against the slab via an eccentric shaft or a crank shaft. In this case, the device is also equipped with upper and lower bearings 21, 22 for supporting rotation of the eccentric shaft or the crank shaft, and a bearing moving device for moving at least one bearing upwards/downwards. The bearing moving device 24 comprises a screw jack 27 which is mounted to a body frame 26 and moves an axial box 25 upwards/downwards, or a wedge plate or a step plate nipped between the body frame 26 and the axial box 25.
申请公布号 JP2000158198(A) 申请公布日期 2000.06.13
申请号 JP19980333477 申请日期 1998.11.25
申请人 ISHIKAWAJIMA HARIMA HEAVY IND CO LTD;NKK CORP 发明人 NARISHIMA SHIGEKI;IDE KENICHI;MOMO YASUSHI;MASUDA SADAKAZU;MURATA SATOSHI;YAMASHINA SHUICHI
分类号 B30B15/06;B21B15/00;B21J1/04;B30B1/26;(IPC1-7):B30B15/06 主分类号 B30B15/06
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