Anordnung mit einer Substratplatte und einem Chip

摘要

The chip (4) is inserted into the penetration (3), such that its opposite ends project out on each side of the substrate (2). The projection (10) on one side, carries the component (5), especially a sensor. The projection (10') on the other, includes the pad (8). The track (7) connecting sensor and pad, passes through the penetration. Between substrate and chip, a seal is provided.