发明名称 PRINTED CIRCUIT BOARD AND METHOD FOR FABRICATING SUCH BOARD
摘要 A printed circuit board assembly (10) having a pair of printed circuit boards (12, 14). Each one of the boards (12, 14) has a conductive via (22) passing from a surface of a dielectric (16) into an interior region (17) of the dielectric (16). Each one of the printed circuit boards (12, 14) has a reference potential layer (20) and a signal conductor (18) disposed in the dielectric (16) thereof parallel to, the reference potential layer (20) thereof to provide a transmission line (25) having a predetermined impedance. The signal conductor (18) of each one of the boards is connected to the conductive via (22) thereof. The conductive via (22) in each one of the boards is configured to provide an impedance to the transmission line (25) thereof substantially matched to the impedance of the transmission line (25) thereof. A first electrical connector (32) is provided having a signal contact (36) connected to the conductive via (22) of one (12) of the boards and a second electrical connector (34) having a signal contact (38) connected to the conductive via (22) of the other one (14) of the boards. The first signal contact (36) of the first electrical conductor (32) is adapted for electrical connection to the second contact (38) of the second electrical connector (34).
申请公布号 WO0033624(A1) 申请公布日期 2000.06.08
申请号 WO1999US28488 申请日期 1999.12.02
申请人 TERADYNE, INC. 发明人 COHEN, THOMAS, S.;GAILUS, MARK, W.;STOKOE, PHILIP, P.
分类号 H05K1/02;H05K1/11;H05K3/30;H05K3/34;H05K3/42 主分类号 H05K1/02
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