Process of manufacturing an optoelectronic semiconductor device

摘要

Optoelectronic component production comprises position adjustment of lens coupling optics (9) while operating mounted laser chips (1). An optoelectronic component production process comprises: (a) providing a semiconductor wafer (2) with metallic structures (13) for electrically contacting and mechanically fixing laser chips (1) with beam paths parallel to the wafer; (b) positioning beam deflector lens coupling optics (9) on the wafer; (c) operating the laser chips and adjusting the spacing between the chip and the optics until the deflected laser light (11) provides a predetermined position of the optical image plane (15); and (d) fixing the optics in the adjusted position.